Tag Archives: packaging

EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution For Fan-Out Wafer-Level Packaging

Close up of EVG's next-generation laser debonding module with solid-state UV laser scanning across the surface of a fixed wafer. (Image Credits: EV Group)   Designed as a module for... AZoNano.com - Nanotechnology News Feed

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Modular Slip Ring – Most usual application packaging machinery

MODULAR SLIP RING Modular slip ring is made of fiberglass reinforced nylon sectors combined with finite number of rings on request. Thanks to this composition its main characteristic is the modularity that guarantees in supplying case a more flexible warehouse management, arranging how much stocked on the basis of the own real necessities. Being an [...]

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