Tag Archives: FanOut

EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution For Fan-Out Wafer-Level Packaging

Close up of EVG's next-generation laser debonding module with solid-state UV laser scanning across the surface of a fixed wafer. (Image Credits: EV Group)   Designed as a module for... AZoNano.com - Nanotechnology News Feed

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